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| 2.0-22.0 GHz GaAs MMIC Power Amplifier August 2006 - Rev 02-Aug-06 CMM0014-BD Chip Diagram 2.0 to 22.0 GHz GaAs MMIC Power Amplifier Advanced Product Information August 2004 (1 of 3) Features Small Size: 45 x 92 mils High Gain: 11.5 dB, Nom Medium Power: +25 dBm, Typ P1dB @14 GHz Directly Cascadable - Fully Matched Unconditionally Stable Single Bias Operation Bias Control pHEMT Technology Silicon Nitride Passivation Specifications (TA = 25C, Vdd = 8V)1 Parameters Units Min Typ Max Frequency Range Small Signal Gain Gain Flatness Gain Variation (-40C to +85C) Input Return Loss Output Return Loss Power Output (@1 dB Gain Compression) 1 P1dB Variation (over operating frequency) P1dB Variation (-40C to +85C) Saturated Output Power Second Order Intercept Point @ 10 GHz Third Order Intercept Point @ 10 GHz Noise Figure Current Thermal Resistance Stability 2 GHz dB dB dB dB dB dBm dBm dBm dBm dBm dBm dB mA C/W 2.0 10.0 22.0 13.5 0.8 0.35 -10.0 -9.0 22.5 4.5 0.25 29.0 48.0 37.5 250 Unconditionally Stable 295 7.5 340 33.0 24.0 Notes: 1. Tested on Celeritek Connectorized evaluation board (standard assembly condition detailed on page 3). 2. Stability factor measured on-wafer. Absolute Maximum Ratings Parameter Rating Die Attach and Bonding Procedures 7V (min.) / 9V (max.) 350 mA 2.8 W +20 dBm -50C to +150C +175C -40 to (see note 2)C Die Attach: Eutectic die attach is recommended. For eutectic die attach: Preform: AuSn (80% Au, 20% Sn); Stage Temperature: 290C, 5C; Handling Tool: Tweezers; Time: 1 min or less. Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (prestressed); Thermocompression bonding is preferred over thermosonic bonding. For thermocompression bonding: Stage Temperature: 250C; Bond Tip Temperature: 150C; Bonding Tip Pressure: 18 to 40 gms depending on size of wire. Drain Voltage Drain Current Continuous Power Dissipation Input Power Storage Temperature Channel Temperature Operating Backside Temperature Notes: 1. Operation outside these limits can cause permanent damage. 2. Calculation maximum operating temperature: Tmax = 175-(Pdis [W] x 33.0) [C]. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 1 of 3 Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-22.0 GHz GaAs MMIC Power Amplifier August 2006 - Rev 02-Aug-06 CMM0014-BD Typical Performance (Vdd = 8V, 300 mA) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 2 of 3 Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-22.0 GHz GaAs MMIC Power Amplifier August 2006 - Rev 02-Aug-06 CMM0014-BD Assembly Example Note: 1. Eutectic attach on at least 30mil thick CuW or CuMo carrier is recommend. 2. For evaluation, a 1.4mil wire diameter lithium gold air coil has been used . Ordering Information The CMM-0014-BD is available in bare die and is shipped in Gel Pak. Package Part Number for Ordering CMM0014-BD Bare Die Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 3 of 3 Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. |
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